Gigabyte B550 AORUS MASTER AM4 ATX Motherboard

Rise From the Darkness

Introducing the all-new AORUS Master B550 Motherboard from Gigabyte. Filled with the latest technologies to take your gaming experience to the next level such as PCI-E 4.0 technology to give you better performance, bandwidth and eye-watering speeds, Type-C rear IO connectivity, triple M.2 connectors, Wi-Fi 6/Bluetooth 5 support and more. Illuminate your system in your own style with Gigabytes RGB Fusion software or even have supported devices be interactive with the new gaming mode to give yourself that additional immersive gaming experience. The AORUS B550 Master is ready to unleash the full potential of the 3rd Generation Ryzen CPUs, give your system the strongest foundations and make your friends and enemies envious of the power you now hold

Keep Your Components

Cool In order to guarantee un-throttled performance Aorus have opted for an advanced thermal solution, including a huge stacked fin heatsink, direct touch heatpipes, thermal guards meaning the B550 Master is capable of keeping the MOSFETs and M.2 SSDs cool and comfortable even under maximum load. Whether you're a gamer, builder or just an enthusiast you can expect lower temperatures and higher performance from the B550 Master.

Direct Touch Heatpipes

Heatpipe directly touches the heating source VRM components that guarantee good contact between VRM and heatsink.

Thermal Base Plate

Addition of a thermal baseplate to increase thermal dissipation and motherboard longevity to provide a strong building foundation.

LAIRD 7.5 W/mK Thermal Pad

Using LAIRD 7.5 W/mK high thermal conductivity pads, it can transfer 4x more heat when compared to traditional thermal pads in same time.

Fins-Array Heatsink

Using a stacked-fin heatsink increases surface area by 300% and can provide atleast 30% lower temperatures on the MOSFETs.

3X M.2 Thermal Guard

Enlarged M.2 thermal guard heatsink helps the high-speed, large capacity of PCIe 4.0/3.0 SSDs to prevent overheat throttling and performance bottlenecks.

16 Phase Digital Power Design

In order to fully support 3rd Generation AMD Ryzen CPUs, the B550 Master comes equipped with the most complete power solution yet, with true direct, digital and multiple power phases, birthed from countless experiments, testing and tinkering the B550 AOROUS MASTER is built using a pure digital CPU power design which includes a digital controller and a total of 16 phases for Vcore and SOC and is capable of providing 70A from each phase and with additional 8+4 solid-pin connectors offering incredibly precise power delivery to even the most power hungry components. The B550 AORUS MASTER will enable you to get the most out of your 3rd Generation Ryzen CPU