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Cooler Master Hyper 212x 4 Heatpipe 1x 120 Pwm Fan Tower Cpu Cooler
- X-Vents Design
- Intel LGA 2011-3 / 2011 / 1366 / 1156 / 1155 / 1151 / 1150 / 775
- AMD FM2+ / FM2 / FM1 / AM3+ / AM3 / AM2+ / AM2
- 4 Direct contact heatpipes / Aluminum fins
Mfr part code: RR-212X-17PK-R1
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Cooler Master Hyper 212x 4 Heatpipe 1x 120 Pwm Fan Tower Cpu Cooler Product Description
High performance Copper heatpipes with a fusion bonded copper powder wick.
Patented CDC technology - 4 direct touch heatpipes creating a gap-less contact surface
Aluminum Fin Array with New Tunnel Effect layout for improved heat dissipation.
4th Generation Bearing - MTBF of 160,000 hours thanks to highly durable POM components.
Redesigned Fan-blades that create vortices to boost airflow without creating more noise.
Smart Fan engine - stops the fan when blocked to prevent damage, and automatically restarts the fan when it has been cleared.
Universal mounting system for all Intel and AMD platforms.
The latest in the extremely popular Hyper 212 series, Cooler Master's Hyper 212X is based on the same patented CDC Quad heatpipe array as the 212 EVO but features several improvements that boost performance and further reduce noise. Thanks to our brand new Smart Engine and POM bearing, the 212X is incredibly durable and will virtually last a lifetime.
Positioned in a 45 degree angle and surrounding the heatpipe, each fin-blade features X-shaped vents that create areas of high and low air pressure, resulting in several controlled vortices. These small and chaotic turbulences produce strong gusts that reduce overall airflow but improve airflow where it matters the most - next to the heatpipes.
Patent "V" Shaped Array
Funnel shaped aluminum fins and a series of perforated dimples guide the airflow towards the heatpipes. Specially designed X-Vents, that act similar to tiny airplane wings and prevent deadspots behind and between heatpipes. The combination of both of these patent technologies results in notably higher airflow over the heatpipes and the adjacent fin area, which ultimately reduces CPU temperatures.
Patented CDC Technology
4 Continuous Direct Contact Heatpipes create a gap-less contact surface for unmatched cooling efficiency.
Optimized fin design
Aluminum Fin Array with Tunnel Effect layout creates micro vortices that boost the airflow and circulate it around the heatpipes.
Supports all current CPU Sockets
Fast and easy to install and extremely reliable, our famous X-Bracket mounting system is compatible with all current sockets.
The POM bearing is coated with Polyoxymethylene material. This type of material is ideal for precision parts requiring high stiffness and provides consistently lower friction levels than traditional bearings. Self-lubricating, lower friction, and dustproof protection, ensures the average lifetime is pushed up to an incredible 160,000 hours.
CPU Socket Intel LGA 2011-3 / 2011 / 1366 / 1156 / 1155 / 1151 / 1150 / 775
AMD FM2+ / FM2 / FM1 / AM3+ / AM3 / AM2+ / AM2
Dimension 120 x 79 x 158 mm / 4.7 x 3.1 x 6.2 inch
Heat Sink Dimensions 116 x 51 x 158 mm / 4.6 x 2.0 x 6.2 inch
Heat Sink Material 4 Direct contact heatpipes / Aluminum fins
Heat Sink Weight 492g / 1.1lb
Heat Pipes Dimensions 6mm
Fan Dimension 120 x 120 x 25 mm / 4.7 x 4.7 x 1 inch
Fan Speed 600 - 2,000 RPM (PWM) ± 10%
Fan Airflow 24.9 - 82.9 CFM ± 10%
Fan Air Pressure 0. 3 - 2.09 mm H2O ± 10%
Fan Life Expectancy 160,000 hours
Fan Noise Level (dB-A) 9 - 36 dBA
Bearing Type 4th Generation Bearing
Fan Rated Voltage 12 VDC
Fan Rated Current 0.37A
Power Consumption 4.44W (max)
Fan Weight 106g / 0.2lb
|Service & Support||Limited warranty - 2 years|
|Service & Support Details||Limited warranty - 2 years||
Heatsink & Fan
|Compatible With||LGA775 Socket, LGA1156 Socket, Socket AM2+, Socket AM3, LGA1155 Socket, Socket AM3+, LGA2011 Socket, Socket FM1, Socket FM2, LGA1150 Socket, Socket FM2+, LGA2011-3 Socket, LGA1151 Socket|
|Fan Bearing||Rifle bearing|
|Rotation Speed||600-1700 rpm|
|Air Pressure||0.3-2.03 mm|
|Noise Level||9 - 27.2 dBA|
|Rated Current||0.1 A|
|Power Consumption||1.2 W|
|Features||Heat pipe technology, Pulse-width modulation (PWM) support, 4 copper heatpipes (6 mm), Continuous Direct Contact (CDC) technology, X-Vent technology|
|Heatsink Dimensions||158 mm x 116 mm x 51 mm|
|Fan Diameter||120 mm|
|Fan Height||25 mm|
|Air Flow||24.9-82.9 cfm|
|Power Connector||4-pin fan connector|
|Rated Voltage||12 V||
|Product Type||Processor cooler|
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